This inventor holds 11 USPTO granted patents and 7 published patent applications, plus 1 CIPO patent. Top assignee: Other. Active years: 2018-2021.
Company Filing History:
11 out of 834,307 Years Active: 2018-2021
Title: Zhanming Li: Innovator in GaN Semiconductor Packaging
Introduction
Zhanming Li is a notable inventor based in Vancouver, Canada. He has made significant contributions to the field of semiconductor technology, particularly in the packaging of Gallium Nitride (GaN) devices. His innovative approaches aim to enhance the performance and reliability of these advanced electronic components.
Latest Patents
Zhanming Li holds a patent for the "Vertical-Side Solder Method And Package For Power GaN Devices." This invention presents a packaged GaN semiconductor device that features improved heat dissipation. The design allows the GaN device to be mounted on a printed circuit board (PCB) with its vertical side, and optionally the back side, in thermal contact with the PCB. This packaging method is compatible with various surface mount technologies, including land grid array (LGA) and ball grid array (BGA). The thermal contact is established through solder, which may also connect a source terminal of the device, thereby enhancing its electrical stability. This innovative packaging is particularly suitable for GaN High Electron Mobility Transistor (HEMT) devices.
Career Highlights
Throughout his career, Zhanming Li has focused on advancing semiconductor packaging technologies. His work has contributed to the development of more efficient and reliable electronic devices, which are essential in various applications, including power electronics and telecommunications.
Collaborations
Zhanming Li has collaborated with several professionals in his field, including Yue Fu and Wai Tung Ng. These partnerships have facilitated the exchange of ideas and expertise, further driving innovation in semiconductor technology.
Conclusion
Zhanming Li's contributions to GaN semiconductor packaging highlight his role as an innovator in the electronics industry. His work not only improves device performance but also paves the way for future advancements in semiconductor technology.