The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2020

Filed:

Jun. 27, 2019
Applicants:

Zhanming LI, West Vancouver, CA;

Yue Fu, Coquitlam, CA;

Yan-fei Liu, Kingston, CA;

Inventors:

Zhanming Li, West Vancouver, CA;

Yue Fu, Coquitlam, CA;

Yan-Fei Liu, Kingston, CA;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 1/30 (2006.01); H03K 17/06 (2006.01); H01L 29/20 (2006.01); H01L 29/778 (2006.01); H01L 27/06 (2006.01); H02M 1/08 (2006.01); H03K 17/081 (2006.01); H01L 27/02 (2006.01); H02M 3/335 (2006.01);
U.S. Cl.
CPC ...
H03K 17/063 (2013.01); H01L 27/0207 (2013.01); H01L 27/0605 (2013.01); H01L 27/0629 (2013.01); H01L 29/2003 (2013.01); H01L 29/7786 (2013.01); H02M 1/08 (2013.01); H02M 3/33592 (2013.01); H03K 17/08104 (2013.01);
Abstract

Voltage stabilizing and voltage regulating circuits implemented in GaN HEMT technology provide stable output voltages suitable for use in applications such as GaN power transistor gate drivers and low voltage auxiliary power supplies for GaN integrated circuits. Gate driver and voltage regulator modules include at least one GaN D-mode HEMT (DHEMT) and at least two GaN E-mode HEMTs (EHEMTs) connected together in series, so that the at least one DHEMT operates as a variable resistor and the at least two EHEMTs operate as a Zener diode that limits the output voltage. The gate driver and voltage regulator modules may be implemented as a GaN integrated circuits, and may be monolithically integrated together with other components such as amplifiers and power HEMTs on a single die to provide a GaN HEMT power module IC.


Find Patent Forward Citations

Loading…