Yung-Sheng Liu

Title: Yung-Sheng Liu: Innovator in Semiconductor Technology

Introduction

Yung-Sheng Liu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work focuses on innovative semiconductor device structures and manufacturing methods that enhance performance and efficiency.

Latest Patents

Among his latest patents is a semiconductor device structure and manufacturing method. This invention includes a semiconductor substrate and a dielectric layer positioned over it. The structure also features a conductive trace on the dielectric layer, along with a conductive feature that has a width equal to or larger than the maximum width of the conductive trace. Additionally, a conductive bump is placed over the conductive feature. Another notable patent is a method for forming bump structures, which involves creating a metal pad on a substrate and forming a resist layer with an opening. This method further includes the formation of a conductive pillar and solder layer, followed by the removal of the resist layer to achieve an angled sidewall on the conductive pillar.

Career Highlights

Yung-Sheng Liu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise and innovative approach have positioned him as a key player in advancing semiconductor technologies.

Collaborations

Throughout his career, Liu has collaborated with notable colleagues, including Li-Guo Lee and Yi-Chen Liu. These partnerships have fostered a collaborative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Yung-Sheng Liu's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to shape the future of semiconductor devices and manufacturing methods.