logo

For the Inventor, By the Inventor

Glastonbury, CT, United States of America

Yun-Biao Xin

This inventor holds 8 USPTO granted patents. Top assignee: Memc Electronic Materials, Inc.. Active years: 2000-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yun-Biao Xin. Retrieved from https://idiyas.com/inventor/yun-biao-xin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 8

% Patents Active = 87.5

Average Co-Inventor Count = 3.1

ph-index = 6

Forward Citations = 114(Granted Patents)


Location History:

  • St. Peters, MO (US) (2000 - 2002)
  • Glastonbury, CT (US) (2003 - 2004)

Company Filing History:

goldMedal8 out of 347 
 
Memc Electronic Materials, Inc.
 patents

Years Active: 2000-2004

Loading Chart...
8 patents (USPTO):Explore Patents
1. 6709981 - Method and apparatus for processing a semiconductor wafer using novel final polishing method (2004-03-23),
2. 6613591 - Method of estimating post-polishing waviness characteristics of a semiconductor wafer (2003-09-02),
3. 6479386 - Process for reducing surface variations for polished wafer (2002-11-12),
4. 6454635 - Method and apparatus for a wafer carrier having an insert (2002-09-24),
5. 6227944 - Method for processing a semiconductor wafer (2001-05-08),
6. 6214704 - Method of processing semiconductor wafers to build in back surface damage (2001-04-10),
7. 6200908 - Process for reducing waviness in semiconductor wafers (2001-03-13),
8. 6114245 - Method of processing semiconductor wafers (2000-09-05),

Title: Innovations of Yun-Biao Xin in Semiconductor Processing

Introduction

Yun-Biao Xin is a prominent inventor based in Glastonbury, CT, known for his significant contributions to semiconductor processing technology. With a total of eight patents to his name, he has made remarkable advancements in the field, particularly in methods and apparatuses for wafer processing.

Latest Patents

One of his latest patents is titled "Method and apparatus for processing a semiconductor wafer using novel final polishing method." This invention outlines a method for manufacturing a semiconductor wafer that includes providing an ingot of semiconductor material, slicing the wafer from the ingot, and processing the wafer to enhance the parallelism of both the front and back surfaces. The final polishing operation is performed by positioning the wafer between two pads, allowing for relative motion to maintain parallelism and produce a finish suitable for integrated circuit fabrication. Additionally, the wafer is rinsed with a fluid to improve hydrodynamic lubrication. Another notable patent is "Method of estimating post-polishing waviness characteristics of a semiconductor wafer." This method estimates the likely waviness of a wafer after polishing by measuring the thickness profile of the wafer's surfaces in an as-cut condition, thus predicting the post-polished waviness.

Career Highlights

Yun-Biao Xin is currently employed at Memc Electronic Materials, Inc., where he continues to innovate in semiconductor technologies. His work has been instrumental in enhancing the efficiency and quality of semiconductor wafer processing.

Collaborations

Throughout his career, Yun-Biao Xin has collaborated with notable colleagues, including Henry Frank Erk and Roland R Vandamme, contributing to advancements in the semiconductor industry.

Conclusion

Yun-Biao Xin's innovative work in semiconductor processing has led to significant advancements in the field, particularly through his patented methods and apparatuses. His contributions continue to shape the future of semiconductor technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…