Yuan-Fu Lan

Title: Innovations of Yuan-Fu Lan in Chip Packaging Technology

Introduction

Yuan-Fu Lan is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of chip packaging technology, holding a total of five patents. His work focuses on enhancing the efficiency and structural integrity of stacked chip packages.

Latest Patents

Yuan-Fu Lan's latest patents include a manufacturing method for a stackable chip package. This method involves encapsulating multiple chips stacked together and aligning conductive elements with a substrate. Another significant patent is for a stacked package structure that features a metal casing, encapsulation, and a redistribution layer. This design improves heat dissipation and structural strength, showcasing his innovative approach to chip packaging.

Career Highlights

Yuan-Fu Lan is currently employed at Powertech Technology Inc., where he continues to develop advanced technologies in the semiconductor industry. His expertise in manufacturing methods and package structures has positioned him as a key player in the field.

Collaborations

Yuan-Fu Lan has collaborated with notable colleagues such as Hsien-Wen Hsu and Ming-Chih Chen. Their combined efforts contribute to the advancement of chip packaging technologies.

Conclusion

Yuan-Fu Lan's innovative work in chip packaging technology has led to significant advancements in the industry. His patents reflect a commitment to improving efficiency and structural integrity in semiconductor applications.