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For the Inventor, By the Inventor

Hsinchu, Taiwan

Yuan-Fu Lan

This inventor holds 5 USPTO granted patents and 4 published patent applications. Top assignee: Powertech Technology Inc.. Active years: 2017-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yuan-Fu Lan. Retrieved from https://idiyas.com/inventor/yuan-fu-lan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 40.0

Average Co-Inventor Count = 3.6

ph-index = 2

Forward Citations = 12(Granted Patents)


Location History:

  • Hsinchu County, TW (2017 - 2021)
  • Hukou Township, Hsinchu County, TW (2019 - 2021)

Company Filing History:

goldMedal5 out of 207 
 
Powertech Technology Inc.
 patents

Years Active: 2017-2021

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5 patents (USPTO):Explore Patents
1. 11024603 - Manufacturing method and a related stackable chip package (2021-06-01),
2. 10892250 - Stacked package structure with encapsulation and redistribution layer and fabricating method thereof (2021-01-12),
3. 10354978 - Stacked package including exterior conductive element and a manufacturing method of the same (2019-07-16),
4. 10224254 - Package process method including disposing a die within a recess of a one-piece material (2019-03-05),
5. 9659884 - Carrier substrate (2017-05-23),

Title: Innovations of Yuan-Fu Lan in Chip Packaging Technology

Introduction

Yuan-Fu Lan is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of chip packaging technology, holding a total of five patents. His work focuses on enhancing the efficiency and structural integrity of stacked chip packages.

Latest Patents

Yuan-Fu Lan's latest patents include a manufacturing method for a stackable chip package. This method involves encapsulating multiple chips stacked together and aligning conductive elements with a substrate. Another significant patent is for a stacked package structure that features a metal casing, encapsulation, and a redistribution layer. This design improves heat dissipation and structural strength, showcasing his innovative approach to chip packaging.

Career Highlights

Yuan-Fu Lan is currently employed at Powertech Technology Inc., where he continues to develop advanced technologies in the semiconductor industry. His expertise in manufacturing methods and package structures has positioned him as a key player in the field.

Collaborations

Yuan-Fu Lan has collaborated with notable colleagues such as Hsien-Wen Hsu and Ming-Chih Chen. Their combined efforts contribute to the advancement of chip packaging technologies.

Conclusion

Yuan-Fu Lan's innovative work in chip packaging technology has led to significant advancements in the industry. His patents reflect a commitment to improving efficiency and structural integrity in semiconductor applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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