The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Dec. 21, 2018
Stacked package structure with encapsulation and redistribution layer and fabricating method thereof
Powertech Technology Inc., Hukou Township, Hsinchu County, TW;
Ming-Chih Chen, Hukou Township, Hsinchu County, TW;
Hung-Hsin Hsu, Hukou Township, Hsinchu County, TW;
Yuan-Fu Lan, Hukou Township, Hsinchu County, TW;
Hsien-Wen Hsu, Hukou Township, Hsinchu County, TW;
Powertech Technology Inc., Hukou Township, TW;
Abstract
A stacked package structure has a metal casing, a stacked chipset, an encapsulation and a redistribution layer. The stacked chipset is adhered in the metal casing. The encapsulation is formed in the metal casing to encapsulate the stacked chip set, but a plurality of surfaces of the metal pads are exposed through the encapsulation. The redistribution layer is further formed on the encapsulation and electrically connects to the metal pads of the stacked chipset. Therefore, the stacked package structure includes the metal casing, so an efficiency of heat dissipation and structural strength are increased.