Hsien-Wen Hsu

Title: Hsien-Wen Hsu: A Pioneer in Stackable Chip Package Innovations

Introduction

Hsien-Wen Hsu is a prominent inventor based in Hsinchu County, Taiwan. With a total of nine patents to his name, he has made significant contributions to the field of semiconductor packaging. His innovative methods and structures have advanced the manufacturing processes within the technology sector.

Latest Patents

Hsien-Wen Hsu's latest patents showcase his expertise in stackable chip packages. One of his notable inventions is a manufacturing method for a stackable chip package. This method encompasses the encapsulation of multiple chips stacked together, positioning lateral surfaces of the stacked chips with conductive elements onto a substrate, followed by the precise alignment of a dielectric layer with openings for a ball mounting process.

Another significant patent involves a stacked package structure with encapsulation and a redistribution layer. This structure includes a metal casing that enhances heat dissipation and overall structural strength. The encapsulation not only integrates the stacked chipset but also ensures that multiple surfaces of the metal pads remain accessible, thus optimizing electrical connectivity through a redistribution layer.

Career Highlights

Hsien-Wen Hsu has amassed a wealth of experience through his work in reputable companies such as Powertech Technology Inc. and Inergy Technology Inc. His roles in these organizations have allowed him to refine his skills and contribute meaningfully to projects that emphasize innovation in semiconductor technologies.

Collaborations

Throughout his career, Hsu has collaborated with esteemed professionals, including Yuan-Fu Lan and Ming-Chih Chen. These collaborations have played a vital role in enhancing his projects and have provided a platform for the exchange of ideas that drive technological advancements.

Conclusion

Hsien-Wen Hsu stands out as a visionary inventor in the realm of semiconductor packaging. His patents not only demonstrate his creative ingenuity but also reflect ongoing advancements in the industry. As the demand for efficient chip packaging continues to grow, Hsu's contributions are sure to influence future developments in this pivotal technological field.