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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10224254 B1

PDFFull Text
Expired
Date of Patent:
Mar. 05, 2019

Filed:

Apr. 26, 2017

Package process method including disposing a die within a recess of a one-piece material

Applicant:

Powertech Technology Inc., Hsinchu County, TW;

Inventors:

Ming-Chih Chen, Hsinchu County, TW;

Hsien-Wen Hsu, Hsinchu County, TW;

Yuan-Fu Lan, Hsinchu County, TW;

Hung-Hsin Hsu, Hsinchu County, TW;

Assignee:

POWERTECH TECHNOLOGY INC., Hsinchu County, TW;

Attorney:

Winston Hsu

Primary Examiner:

Wael M Fahmy

Assistant Examiner:

Sarah Kate Salerno

Int. Cl.
CPC ...
H01L 23/043 (2006.01); H01L 23/06 (2006.01); H01L 23/31 (2006.01); H01L 21/82 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/043 (2013.01); H01L 21/82 (2013.01); H01L 23/06 (2013.01); H01L 23/315 (2013.01); H01L 23/3114 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 24/10 (2013.01); H01L 24/11 (2013.01); H01L 2221/1068 (2013.01); H01L 2224/10 (2013.01); H01L 2224/11 (2013.01);
Abstract

A package structure may include a one-piece metal carrier, a die, a mold layer and a redistribution layer. The one-piece metal carrier may include a bottom portion and a first supporting structure, and the one-piece metal carrier may have a recess defined by the bottom portion and the first supporting structure. The die may be disposed in the recess of the one-piece metal carrier, and the die may have a plurality of conductive bumps. The mold layer may be formed to encapsulate the die. The mold layer may expose a portion of each of the plurality of conductive bumps and a portion of the first supporting structure. The redistribution layer may be disposed on the mold layer and electrically connected to the plurality of conductive bumps.

Find Patent Forward Citations

Chen, Ming-Chih. (2019). Package process method including disposing a die within a recess of a one-piece material (U.S. Patent No. 10224254). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10224254

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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