Yu-Wei Lin

This inventor holds 38 USPTO granted patents and 8 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Grand-Tek Technology Co., Ltd., Diodes Inc.. Active years: 2012-2026.

USPTO Granted Patents = 38 (Patent Applications = 8)

% Patents Active = 78.9

EPO Patents = 1

Average Co-Inventor Count = 2.4

ph-index = 6

Forward Citations = 138(Granted Patents)

Location History:

Hsinchu, TW (2013)
Chu Bei, TW (2012 - 2018)
New Taipei, TW (2013 - 2024)

Company Filing History:

23 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

5 out of 19

Grand-Tek Technology Co., Ltd.

Ship and Ocean Industries R&d Center

Solid State System Co., Ltd.

patents

Years Active: 2012-2026

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Areas of Expertise:

Semiconductor Packaging

Interconnection Structure

Micro-Electro-Mechanical Systems

RF Connector

Phase Optimization

Data Correction

Solderless Interconnection

Antenna Design

Calibration Circuit

Hinge Mechanism

Bit-Level Mode Retimer

Substrate Design

38 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12738339 - Integrated circuit and method of operating same (2026-09-15),

2. 12620800 - DC system protection apparatus with communication resetting function (2026-05-05),

3. 12214849 - Vessel power safety control system and operating method thereof (2025-02-04),

4. 12181523 - Data correction and phase optimization in high-speed receivers (2024-12-31),

5. 12176299 - Semiconductor device and manufacturing method thereof (2024-12-24),

6. 11961810 - Solderless interconnection structure and method of forming same (2024-04-16),

7. 11736266 - Phase interpolator circuitry for a bit-level mode retimer (2023-08-22),

8. 11587887 - Semiconductor device and manufacturing method thereof (2023-02-21),

9. 11489657 - Bit-level mode retimer (2022-11-01),

10. 11101596 - Waterproof enhanced RF connector (2021-08-24),

11. 11043462 - Solderless interconnection structure and method of forming same (2021-06-22),

12. 10879192 - Semiconductor structure and manufacturing method thereof (2020-12-29),

13. 10319691 - Solderless interconnection structure and method of forming same (2019-06-11),

14. 10128195 - Substrate design with balanced metal and solder resist density (2018-11-13),

15. 10043774 - Integrated circuit packaging substrate, semiconductor package, and manufacturing method (2018-08-07),

Title: The Innovative Journey of Yu-Wei Lin

Introduction: Yu-Wei Lin, a talented inventor hailing from New Taipei, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Yu-Wei Lin holds several patents in the areas of electronics and software development, with his most recent patent focusing on a cutting-edge artificial intelligence algorithm for autonomous vehicles.

Career Highlights: Lin's career highlights include working as a lead engineer at a prominent tech company in Taiwan, where he spearheaded the development of a revolutionary smart home system that has since gained international acclaim.

Collaborations: Throughout his career, Yu-Wei Lin has collaborated with top researchers and engineers from renowned universities and research institutions worldwide, fostering a culture of innovation and excellence in all his projects.

Conclusion: Yu-Wei Lin's passion for pushing the boundaries of technology and his relentless pursuit of innovation continue to inspire the next generation of inventors and engineers globally.