Yu-Shun Hsieh

Title: Innovations of Yu-Shun Hsieh in Semiconductor Technology

Introduction

Yu-Shun Hsieh is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of five patents. His work focuses on lead frames and package structures, which are essential components in the manufacturing of electronic devices.

Latest Patents

Among his latest patents, Yu-Shun Hsieh has developed innovative designs for lead frames and package structures. One of his notable patents describes a lead frame that includes a die paddle and a plurality of leads surrounding the die paddle. Each lead consists of an inner lead portion and an outer lead portion, with the inner lead portion being adjacent to and spaced apart from the die paddle. The design ensures that the bottom surface of the inner lead portion is higher than that of the outer lead portion, featuring supporting members with a convex surface. Another patent outlines a lead frame that incorporates a die paddle, multiple leads, at least one connector, and a bonding layer, enhancing the overall functionality and reliability of semiconductor packages.

Career Highlights

Yu-Shun Hsieh is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in the semiconductor industry. His expertise in lead frame technology has positioned him as a key contributor to the company's advancements in electronic packaging solutions.

Collaborations

Throughout his career, Yu-Shun Hsieh has collaborated with talented individuals such as Shao-Lun Yang and Chia Yi Cheng. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in semiconductor manufacturing.

Conclusion

Yu-Shun Hsieh's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative designs continue to shape the future of electronic devices.