The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
May. 23, 2019
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Shao-Lun Yang, Kaohsiung, TW;
Yu-Shun Hsieh, Kaohsiung, TW;
Chia Yi Cheng, Kaohsiung, TW;
Hong Jie Chen, Kaohsiung, TW;
Shih Yu Huang, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor device package includes: (1) a lead frame including a connection element and multiple leads; (2) a package body encapsulating the lead frame, wherein the package body includes a lower surface and an upper surface opposite to the lower surface, the package body includes a cavity exposing at least one of the leads; (3) at least one conductive via disposed in the cavity of the package body, electrically connected to the connection element, and exposed from the upper surface of the package body; and (4) a conductive layer disposed on the upper surface of the package body and the conductive via.