Chia Yi Cheng

Title: The Innovative Contributions of Chia Yi Cheng

Introduction

Chia Yi Cheng is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing semiconductor device packages, which are crucial for modern electronic components.

Latest Patents

Chia Yi Cheng's latest patents include innovative designs for semiconductor device packages. The first patent describes a semiconductor device package that features a lead frame, a package body, and conductive elements. This design includes a lead frame with a connection element and multiple leads, encapsulated by a package body that has a cavity exposing at least one lead. Additionally, it incorporates conductive vias that are electrically connected to the connection element and a conductive layer on the upper surface of the package body. The second patent also outlines a semiconductor device package that includes a lead frame, an electronic component, and a package body, emphasizing the importance of conductive vias and layers in enhancing the functionality of the device.

Career Highlights

Chia Yi Cheng is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in the semiconductor field. His work has contributed to advancements in electronic packaging technology, making devices more efficient and reliable.

Collaborations

Chia Yi Cheng has collaborated with notable colleagues such as Shao-Lun Yang and Yu-Shun Hsieh. These collaborations have fostered a creative environment that encourages the development of cutting-edge semiconductor technologies.

Conclusion

Chia Yi Cheng's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to shape the future of electronic devices, ensuring they meet the demands of modern technology.