The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Oct. 20, 2017
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Shao-Lun Yang, Kaohsiung, TW;
Yu-Shun Hsieh, Kaohsiung, TW;
Chia Yi Cheng, Kaohsiung, TW;
Hong Jie Chen, Kaohsiung, TW;
Shih Yu Huang, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor device package includes a lead frame, an electronic component, a package body, at least one conductive via and a conductive layer. The lead frame includes a paddle, a connection element and a plurality of leads. The electronic component is disposed on the paddle. The package body encapsulates the electronic component and the lead frame. The at least one conductive via is disposed in the package body, electrically connected to the connection element, and exposed from the package body. The conductive layer is disposed on the package body and the conductive via.