Kaohsiung, Taiwan

Hong Jie Chen

USPTO Granted Patents = 4 

Average Co-Inventor Count = 5.2

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2019-2024

Loading Chart...
4 patents (USPTO):Explore Patents

Title: Innovations of Hong Jie Chen

Introduction

Hong Jie Chen is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on electronic packaging and semiconductor device packages, showcasing his expertise in innovative manufacturing methods.

Latest Patents

Hong Jie Chen's latest patents include an electronic package and a method of manufacturing it. This electronic package features a carrier, an antenna substrate, and an electronic component. The design includes a resonant cavity within the antenna substrate, which is strategically placed over the carrier's first surface. Additionally, the electronic component is positioned between the antenna substrate and the carrier's second surface. Another notable patent involves a semiconductor device package that comprises a substrate, an antenna, and an active component. In this design, the antenna is partially integrated within the substrate, and the active component is electrically connected to the antenna, allowing for adjustable positioning.

Career Highlights

Hong Jie Chen is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop innovative solutions in semiconductor packaging. His work has been instrumental in advancing the efficiency and functionality of electronic devices.

Collaborations

He collaborates with talented coworkers, including Shao-Lun Yang and Yu-Shun Hsieh, contributing to a dynamic team focused on cutting-edge technology.

Conclusion

Hong Jie Chen's contributions to the field of semiconductor technology through his patents and collaborative efforts highlight his role as an influential inventor. His work continues to shape the future of electronic packaging and semiconductor devices.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…