The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Jun. 14, 2019
Device including a plurality of leads surrounding a die paddle and method for manufacturing the same
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Kuang-Hsiung Chen, Kaohsiung, TW;
Chih-Hung Hsu, Kaohsiung, TW;
Mei-Lin Hsieh, Kaohsiung, TW;
Yi-Cheng Hsu, Kaohsiung, TW;
Yuan-Chun Chen, Kaohsiung, TW;
Yu-Shun Hsieh, Kaohsiung, TW;
Ko-Pu Wu, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.