Kaohsiung, Taiwan

Mei-Lin Hsieh


Average Co-Inventor Count = 5.8

ph-index = 1


Location History:

  • Taoyuan County, TW (2012)
  • Zhongli, TW (2013)
  • Kaohsiung, TW (2021 - 2022)

Company Filing History:


Years Active: 2012-2022

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4 patents (USPTO):Explore Patents

Title: Innovations of Mei-Lin Hsieh

Introduction

Mei-Lin Hsieh is a prominent inventor based in Kaohsiung, Taiwan. She has made significant contributions to the field of semiconductor technology, holding a total of four patents. Her work focuses on lead frames and package structures, which are essential components in the manufacturing of electronic devices.

Latest Patents

One of her latest patents is titled "Lead frame, package structure and method for manufacturing the same." This invention describes a lead frame that includes a die paddle, a plurality of leads, at least one connector, and a bonding layer. The leads are designed to surround the die paddle, with each lead featuring an inner lead portion adjacent to and spaced apart from the die paddle, as well as an outer lead portion opposite to the inner lead portion. The connector connects to the die paddle and the inner lead portions of the leads, while the bonding layer is positioned on the lower surface of the die paddle and the outer lead portions.

Another notable patent is "Device including a plurality of leads surrounding a die paddle and method for manufacturing the same." This device also includes a die paddle and a plurality of leads that surround it. Each lead consists of an inner lead portion, an outer lead portion, and a bridge portion connecting the two. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below it. The combined thickness of the upper bond section and the lower support section exceeds that of the bridge portion, enhancing the device's structural integrity.

Career Highlights

Mei-Lin Hsieh is currently employed at Advanced Semiconductor Engineering, Inc., where she continues to innovate in the semiconductor industry. Her expertise in lead frame technology has positioned her as a key player in the development of advanced packaging solutions for electronic components.

Collaborations

Throughout her career, Mei-Lin has collaborated with talented individuals such as Yi-Cheng Hsu and Chih-Hung Hsu. These partnerships have fostered a creative environment that encourages the exchange of ideas and the advancement of technology.

Conclusion

Mei-Lin Hsieh's contributions to semiconductor technology through her innovative patents and collaborations highlight her significant role in the industry. Her work continues to influence the development of electronic devices, showcasing the importance of innovation in technology.

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