The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2012

Filed:

Aug. 19, 2010
Applicants:

Yueh-chen Hsu, Taoyuan County, TW;

Mei-lin Hsieh, Taoyuan County, TW;

Chih-hung Hsu, Taipei County, TW;

Kuang-hsiung Chen, Taoyuan County, TW;

Yi-cheng Hsu, Taoyuan County, TW;

Inventors:

Yueh-Chen Hsu, Taoyuan County, TW;

Mei-Lin Hsieh, Taoyuan County, TW;

Chih-Hung Hsu, Taipei County, TW;

Kuang-Hsiung Chen, Taoyuan County, TW;

Yi-Cheng Hsu, Taoyuan County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

A leadframe including a die pad, leads, an outer frame, connecting bars and grounding bars is provided. Each of the grounding bars is suspended between two connecting bars by being connected with branches of the two connecting bars, such that the grounding bars are spaced by the die pad. The leadframe and the chip package of the present invention can permit a great design variation.


Find Patent Forward Citations

Hsu, Yueh-Chen. (2012). Leadframe and chip package (U.S. Patent No. 8304865). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8304865

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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