The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2013
Filed:
Aug. 29, 2011
Kuang-hsiung Chen, Taoyuan, TW;
Sheng-ming Wang, Taoyuan, TW;
Hsiang-ming Feng, Tainan, TW;
Yu-ying Lee, Taichung, TW;
Mei-lin Hsieh, Zhongli, TW;
Kuang-Hsiung Chen, Taoyuan, TW;
Sheng-Ming Wang, Taoyuan, TW;
Hsiang-Ming Feng, Tainan, TW;
Yu-Ying Lee, Taichung, TW;
Mei-Lin Hsieh, Zhongli, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A Quad Flat No Leads (QFN) package includes a lead frame, a chip, an encapsulant, and a protective layer. The lead frame includes a plurality of leads. Each of the leads has a lower surface that is divided into a contact area and a non-contact area. The chip is configured on and electrically connected to the lead frame. The encapsulant encapsulates the chip and the leads and fills spaces between the leads. The contact areas and the non-contact areas of the leads are exposed by the encapsulant. The protective layer covers the non-contact areas of the leads.