Yu-Jen Chang

Title: Innovations of Yu-Jen Chang

Introduction

Yu-Jen Chang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of interconnect structures. With a total of eight patents to his name, Chang's work has had a substantial impact on the industry.

Latest Patents

One of Yu-Jen Chang's latest patents is titled "Vias for cobalt-based interconnects and methods of fabrication thereof." This patent discloses innovative interconnect structures and techniques for forming these structures. An exemplary interconnect structure includes a conductive feature made of cobalt, with a via positioned over it. The via consists of a first barrier layer made of titanium, a second barrier layer that includes titanium and nitrogen, and a bulk layer that can include tungsten and/or cobalt. Additionally, a capping layer may be present over the conductive feature, allowing the via to extend through it and contact the conductive feature. In some implementations, the capping layer comprises cobalt and silicon.

Career Highlights

Yu-Jen Chang has worked with notable companies in the semiconductor industry, including Taiwan Semiconductor Manufacturing Company Ltd. and Winbond Electronics Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in semiconductor technology.

Collaborations

Throughout his career, Yu-Jen Chang has collaborated with several talented individuals, including Min-Yann Hsieh and Hua Feng Chen. These collaborations have fostered a creative environment that has led to the development of advanced technologies.

Conclusion

Yu-Jen Chang's contributions to the field of semiconductor technology, particularly through his innovative patents, highlight his role as a leading inventor. His work continues to influence the industry and pave the way for future advancements.