Yu-Cheng Sun

Title: Yu-Cheng Sun: Innovator in Semiconductor Technology

Introduction

Yu-Cheng Sun is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on innovative routing structures and power delivery devices that enhance the efficiency and performance of electronic systems.

Latest Patents

One of Yu-Cheng Sun's latest patents is titled "Routing structure between dies and method for arranging routing between dies." This invention provides a routing structure that includes a trace layer on a substrate, with multiple routing paths embedded within it. The design features a first die and a second die connected by these routing paths, with specific spacing and orientation to optimize performance. Another notable patent is the "Power delivery device and method," which describes a power delivery system comprising a printed circuit board (PCB), a package device, and a chip connecting device. This system is designed to manage multiple reference voltages efficiently, utilizing a bump array for effective voltage transmission.

Career Highlights

Yu-Cheng Sun has worked with leading companies in the semiconductor industry, including Global Unichip Corporation and Taiwan Semiconductor Manufacturing Company. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in semiconductor technology.

Collaborations

Throughout his career, Yu-Cheng Sun has collaborated with notable professionals in the field, including Sheng-Fan Yang and Yuan-Hung Lin. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Yu-Cheng Sun's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative solutions continue to shape the future of electronic systems.