The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2020
Filed:
Apr. 29, 2019
Global Unichip Corporation, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Sheng-Fan Yang, Hsinchu, TW;
Yuan-Hung Lin, Hsinchu, TW;
Yu-Cheng Sun, Hsinchu, TW;
Steve S. A. Wan, Hsinchu, TW;
GLOBAL UNICHIP CORPORATION, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
An integrated circuit package element provided includes a chip element and a package module coupled to the chip element. The chip element includes two driving units that are electrically connected to each other. The package module includes a grounding area, two individual power distributed networks and a grounded shielding structure which is completely disposed between the individual power distributed networks, electrically connected to the chip element, and configured to block power noise coupling between the first electric power distribution network and the second electric power distribution network. The grounding area is electrically connected to the individual electric power distribution networks and the grounded shielding structure.