The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2022
Filed:
Aug. 16, 2020
Global Unichip Corporation, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Sheng-Fan Yang, Hsinchu, TW;
Yuan-Hung Lin, Hsinchu, TW;
Yu-Cheng Sun, Hsinchu, TW;
Hung-Chang Kuo, Hsinchu, TW;
Yung-Yang Liang, Hsinchu, TW;
GLOBAL UNICHIP CORPORATION, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A power delivery device includes a printed circuit board (PCB), a package device, and a chip connecting device. The PCB is configured to receive a first reference voltage and a second reference voltage. The package device is coupled to the PCB, and includes a bump array. The chip connecting device is coupled to the bump array of the package device, and configured to output a first supply voltage and a second supply voltage. The bump array includes first bumps and second bumps. The first bumps are configured to transmit the first reference voltage. The second bumps are configured to transmit the second reference voltage. The first bumps and the second bumps are disposed in parallel.