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For the Inventor, By the Inventor

Taichung, Taiwan

Yu-Chen Chan

This inventor holds 24 USPTO granted patents and 17 published patent applications, primarily in Semiconductor Technology. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Chen Chan. Retrieved from https://idiyas.com/inventor/yu-chen-chan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 100.0

Average Co-Inventor Count = 4.8

ph-index = 1

Forward Citations = 8(Granted Patents)


Location History:

  • Taichung, TW (2018 - 2024)
  • Hsinchu, TW (2024)

Company Filing History:

goldMedal24 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2018-2026

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Areas of Expertise:
Graphene
Interconnect
Semiconductor Structure
Low Resistance
Two-Dimensional Materials
Capping Layers
Conductive Structures
Device Fabrication
Protection Liner
Manufacturing Methods
Vertical Conductive
Reliability Enhancement
24 patents (USPTO):Explore Patents
1. 12721154 - Semiconductor structure having verticle conductive graphene and method for forming the same (2026-08-25),
2. 12690433 - Low resistance interconnect features and method for manufacturing the same (2026-07-21),
3. 12677646 - Semiconductor structure including cap layer of two-dimensional material and method for manufacturing the same (2026-07-07),
4. 12648419 - Semiconductor structure having vertical conductive graphene and method for forming the same (2026-06-02),
5. 12525538 - Semiconductor device structure and methods of forming the same (2026-01-13),
6. 12525531 - Protection liner on interconnect wire to enlarge processing window for overlying interconnect via (2026-01-13),
7. 12417981 - Semiconductor device including graphene interconnect and method of making the semiconductor device (2025-09-16),
8. 12211740 - Interconnect structure and methods of forming the same (2025-01-28),
9. 12113021 - Graphene-assisted low-resistance interconnect structures and methods of formation thereof (2024-10-08),
10. 12068254 - Interconnection structure and methods of forming the same (2024-08-20),
11. 12068253 - Semiconductor structure with two-dimensional conductive structures (2024-08-20),
12. 12051645 - Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability (2024-07-30),
13. 12027419 - Semiconductor device including liner structure (2024-07-02),
14. 11948837 - Semiconductor structure having vertical conductive graphene and method for forming the same (2024-04-02),
15. 11908794 - Protection liner on interconnect wire to enlarge processing window for overlying interconnect via (2024-02-20),

Title: Yu-Chen Chan - Innovative Inventor from Taichung

Introduction: Yu-Chen Chan is a talented inventor hailing from Taichung, Taiwan. She is known for her groundbreaking work in various fields of innovation.

Latest Patents: Yu-Chen Chan holds several patents in the areas of technology and healthcare, showcasing her diverse range of expertise and creativity.

Career Highlights: Throughout her career, Yu-Chen Chan has been recognized for her exceptional contributions to the world of inventions. Her innovative solutions have significantly impacted industries worldwide.

Collaborations: Yu-Chen Chan has collaborated with leading research institutions and universities to further her inventions and bring them to market. Her partnerships have been instrumental in the success of her projects.

Conclusion: Yu-Chen Chan continues to inspire with her innovative spirit and dedication to creating solutions that make a difference. Her work serves as a testament to the power of creativity and ingenuity in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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