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For the Inventor, By the Inventor

Anyang-si, South Korea

Younglyong Kim

USPTO Granted Patents = 11 

Average Co-Inventor Count = 1.9

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:

goldMedal11 out of 131,611 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2021-2025

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11 patents (USPTO):Explore Patents
1. 12476179 - Semiconductor package including through-silicon via and method of forming the same (2025-11-18),
2. 12341074 - Semiconductor package with increased thermal dissipation (2025-06-24),
3. 12237290 - Semiconductor packages and methods of manufacturing the semiconductor packages (2025-02-25),
4. 12166013 - Semiconductor package, and a package on package type semiconductor package having the same (2024-12-10),
5. 12033973 - Semiconductor package (2024-07-09),
6. 11817443 - Semiconductor package including a first semiconductor chip with a plurality of first chip pads directly bonded to a plurality of second chip pads of an upper semiconductor chip (2023-11-14),
7. 11676875 - Semiconductor package including non-conductive film between package substrate and semiconductor chip thereon (2023-06-13),
8. 11581234 - Semiconductor package with improved heat dissipation (2023-02-14),
9. 11488937 - Semiconductor package with stack structure and method of manufacturing the semiconductor package (2022-11-01),
10. 11222882 - Semiconductor package including dummy chip on a first semiconductor chip and laterally spaced apart from a second semiconductor chip (2022-01-11),
11. 11164805 - Semiconductor package including non-conductive film between package substrate and semiconductor chip thereon (2021-11-02),

Title: Younglyong Kim: Innovator in Semiconductor Technology

Introduction

Younglyong Kim is a prominent inventor based in Anyang-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His work focuses on enhancing the performance and efficiency of semiconductor packages.

Latest Patents

Among his latest innovations is a semiconductor package that includes a through-silicon via and a method of forming the same. This package features a substrate and multiple sub-packages, each containing a semiconductor chip and an interposer with first through-silicon vias. The design aims to improve the functionality and integration of semiconductor devices. Another notable patent is for a semiconductor package with increased thermal dissipation. This package incorporates a heat dissipation pattern that penetrates the interposer substrate, ensuring effective thermal management for semiconductor chips.

Career Highlights

Younglyong Kim is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His innovative designs and patents have positioned him as a key player in the industry, contributing to advancements that benefit various electronic applications.

Collaborations

Throughout his career, Younglyong Kim has collaborated with talented individuals such as Myungkee Chung and Aenee Jang. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Younglyong Kim's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to shape the future of electronic devices and systems.

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