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For the Inventor, By the Inventor

Seoul, South Korea

Young Suk Chung

This inventor holds 19 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignees: Amkor Technology, Inc., Utstarcom Korea Technologies Limited. Active years: 2002-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Young Suk Chung. Retrieved from https://idiyas.com/inventor/young-suk-chung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19 

% Patents Active = 84.2

Average Co-Inventor Count = 3.8

ph-index = 11

Forward Citations = 646(Granted Patents)


Company Filing History:

goldMedal18 out of 1,009 
 
Amkor Technology, Inc.
 patents
silverMedal1 out of 1 
 
Utstarcom Korea Technologies Limited
 patent

Years Active: 2002-2016

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Areas of Expertise:
Leadframe
Semiconductor Package
Wafer Level Chip
Chip Stacking
Solder Joint Strength
Contact Interface
Fabrication Method
Encapsulant
Wire Bonding
Redistibution Layers
Lead Locks
19 patents (USPTO):Explore Patents
1. 9478517 - Electronic device package structure and method of fabricating the same (2016-10-25),
2. 9362210 - Leadframe and semiconductor package made using the leadframe (2016-06-07),
3. 8410585 - Leadframe and semiconductor package made using the leadframe (2013-04-02),
4. 7977783 - Wafer level chip size package having redistribution layers (2011-07-12),
5. 7944043 - Semiconductor device having improved contact interface reliability and method therefor (2011-05-17),
6. 7564122 - Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant (2009-07-21),
7. D593051 - Mobile phone (2009-05-26),
8. 7102208 - Leadframe and semiconductor package with improved solder joint strength (2006-09-05),
9. 7057280 - Leadframe having lead locks to secure leads to encapsulant (2006-06-06),
10. 7042068 - Leadframe and semiconductor package made using the leadframe (2006-05-09),
11. 6953988 - Semiconductor package (2005-10-11),
12. 6858919 - Semiconductor package (2005-02-22),
13. 6825062 - Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant (2004-11-30),
14. 6759737 - Semiconductor package including stacked chips with aligned input/output pads (2004-07-06),
15. 6677662 - Clamp and heat block assembly for wire bonding a semiconductor package assembly (2004-01-13),

Title: The Innovator: Young Suk Chung and His Contributions to Electronic Device Packaging

Introduction: Young Suk Chung is a notable inventor based in Seoul, South Korea. With a remarkable portfolio of 19 patents, his contributions to the field of electronic device packaging have been influential in advancing technology.

Latest Patents: Chung's latest innovations include a unique electronic device package structure and a method of fabricating it. In his design, an electronic device package features an electronic die with conductive pads on one surface that connects to a lead. A conductive layer efficiently links the pad to the lead, ensuring seamless electrical connections. Additionally, he has developed leadframes and semiconductor packages that optimize product design. His work on metal leadframes encompasses a rectangular frame, chip pads, and multiple leads with specific structural adjustments, including vertically recessed horizontal surfaces. This innovative design facilitates effective encapsulation and secure bonding of semiconductor chips, showcasing Chung's commitment to enhancing electronic device reliability.

Career Highlights: Young Suk Chung has made significant strides in the industry through his tenure at leading technology companies such as Amkor Technology, Inc. and Utstarcom Korea Technologies Limited. His work has deeply influenced electronic packaging techniques and continues to shape the industry.

Collaborations: Throughout his career, Chung has worked alongside talented individuals such as Jae Hak Yee and Jae Hun Ku. Their collaborative efforts have contributed to the success and advancement of their projects, enhancing the field of electronic device packaging.

Conclusion: Young Suk Chung exemplifies the spirit of innovation with his extensive patent portfolio and impactful contributions to electronic device packaging. His dedication to improving technology resonates through his work, inspiring future generations of inventors and engineers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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