The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2005
Filed:
Sep. 17, 2004
Seong Min Seo, Seoul, KR;
Young Suk Chung, Seoul, KR;
Jong Sik Paek, Seoul, KR;
Jae Hun Ku, Singapore, SG;
Jae Hak Yee, Singapore, SG;
Seong Min Seo, Seoul, KR;
Young Suk Chung, Seoul, KR;
Jong Sik Paek, Seoul, KR;
Jae Hun Ku, Singapore, SG;
Jae Hak Yee, Singapore, SG;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A semiconductor package is disclosed that bonds a semiconductor chip to a leadframe using a flip chip technology. An exemplary semiconductor package includes a semiconductor chip having a plurality of input-output pads at an active surface thereof. A plurality of leads are superimposed by the bond pads and active surface of the semiconductor chip. The leads have at least one exposed surface at a bottom surface of the package body. A plurality of conductive connecting means electrically connect the input-output pads of the chip to the leads. A package body is formed over the semiconductor chip and the conductive connecting means. The bottom surface portions of the leads are exposed to the outside.