The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2016
Filed:
Dec. 04, 2013
Applicant:
Amkor Technology, Inc., Chandler, AZ (US);
Inventors:
Jong Sik Paek, Incheon, KR;
Doo Hyun Park, Gyeonggi-do, KR;
Yoon Joo Kim, Seoul, KR;
Seong Min Seo, Seoul, KR;
Young Suk Chung, Seoul, KR;
Assignee:
Amkor Technology, Inc., Tempe, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/043 (2006.01); H01L 23/00 (2006.01); H01L 23/16 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/82 (2013.01); H01L 23/16 (2013.01); H01L 23/4951 (2013.01); H01L 23/49517 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01); H01L 21/561 (2013.01); H01L 23/3107 (2013.01); Y10T 29/49117 (2015.01);
Abstract
In one embodiment, an electronic device package structure includes an electronic die having conductive pads on one surface. The one surface is further attached to at least one lead. A conductive layer covers at least one conductive pad and at least portion of the lead thereby electrically connecting the lead to the conductive pad.