The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2004
Filed:
Oct. 13, 2000
Young Suk Chung, Seoul, KR;
Soo Jung Park, Seoul, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A clamp and heat block assembly for wire bonding a semiconductor package assembly. The package assembly has a semiconductor chip having a plurality of bond pads on an upper surface the chip, a chip paddle secured to a bottom surface of the chip by an adhesive, a plurality of tie bars being connected to corners of the chip paddle and externally extending from the chip paddle, a plurality of leads radially formed at regular intervals along and spaced apart from the chip paddle and extending towards the chip paddle. The package assembly further includes a plurality of conductive wires electrically connected to the leads and the chip. The heat block assembly includes a heat block, a guide block, and a clamp. The guide block has a raised portion for receiving the heat block, which has a groove mating with the raised portion of the guide block. The guide block and heat block are secured to the package assembly by the clamp, which engages the package assembly on an upper surface of the leads. The clamp has a notch adapted to identify a first lead of the package assembly.