Campbell, CA, United States of America

Young Jeen Paik

USPTO Granted Patents = 19 

Average Co-Inventor Count = 2.2

ph-index = 7

Forward Citations = 237(Granted Patents)


Location History:

  • Rancho Palos Verdes, CA (US) (1981)
  • Rancho Dominguez, CA (US) (1997)
  • Campbell, CA (US) (2005 - 2023)

Company Filing History:


Years Active: 1981-2024

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19 patents (USPTO):

Title: Young Jeen Paik: Innovator in Chemical Mechanical Polishing Technology

Introduction

Young Jeen Paik is a prominent inventor based in Campbell, California, known for his significant contributions to the field of chemical mechanical polishing. With 19 patents to his name, he is recognized for his innovative approaches to improving substrate processing techniques.

Latest Patents

Among his latest inventions is the "Carrier head membrane with regions of different roughness." This apparatus features a flexible membrane designed for use with a carrier head in substrate chemical mechanical polishing. The membrane showcases an outer surface that includes a central portion and an edge portion, with distinct surface roughness levels; the central portion having a first surface roughness that is greater than the second surface roughness of the edge portion. Additionally, he developed a complementary patent: the "Method of making carrier head membrane with regions of different roughness," which outlines a process for creating such a membrane.

Career Highlights

Throughout his career, Young Jeen Paik has worked with leading companies in the technology sector, notably Applied Materials, Inc. His experience in these organizations has allowed him to refine his engineering skills and push the boundaries of innovation in his field.

Collaborations

Young Jeen Paik has collaborated with various talented individuals, including Ashish Bhatnagar and Kadthala Ramaya Narendrnath. These collaborations have fostered a creative environment for developing advanced technologies in substrate processing.

Conclusion

Young Jeen Paik exemplifies the spirit of innovation through his patents and collaborative efforts in the realm of chemical mechanical polishing. His work continues to influence the industry, contributing towards enhanced efficiency and effectiveness in substrate processing applications.

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