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For the Inventor, By the Inventor

Gyeonggi-do, South Korea

Young Hee Song

USPTO Granted Patents = 17 

 

Average Co-Inventor Count = 2.9

ph-index = 6

Forward Citations = 185(Granted Patents)


Location History:

  • Seongnam, KR (1998 - 1999)
  • Kyungki-do, KR (2002 - 2005)
  • Yongin, KR (2005 - 2007)
  • Gyunggi-do, KR (2013)
  • Gyeonggi-do, KR (2014 - 2015)
  • Seongnam-si, KR (2015 - 2019)

Company Filing History:

goldMedal15 out of 131,744 
 
Samsung Electronics Co., Ltd.
 patents
silverMedal2 out of 832,880 
Other
 patents

Years Active: 1998-2019

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17 patents (USPTO):Explore Patents
1. 10522522 - Package substrate comprising side pads on edge, chip stack, semiconductor package, and memory module comprising same (2019-12-31),
2. 10474192 - Wearable smart device having flexible semiconductor package mounted on a band (2019-11-12),
3. 9028082 - Light source module and illumination apparatus having the same (2015-05-12),
4. 8933474 - Light emitting diode package and manufacturing method thereof (2015-01-13),
5. 8894240 - Illumination device (2014-11-25),
6. 8841693 - Light emitting device package and manufacturing method thereof (2014-09-23),
7. 8722435 - Light emitting device package and method of manufacturing the same (2014-05-13),
8. 8679872 - Light emitting device package and manufacturing method thereof (2014-03-25),
9. 8587010 - Light emitting device package and method of manufacturing the same (2013-11-19),
10. 7208343 - Semiconductor chip, chip stack package and manufacturing method (2007-04-24),
11. 6855575 - Semiconductor chip package having a semiconductor chip with center and edge bonding pads and manufacturing method thereof (2005-02-15),
12. 6852607 - Wafer level package having a side package (2005-02-08),
13. 6849802 - Semiconductor chip, chip stack package and manufacturing method (2005-02-01),
14. 6573611 - Dual-lead type square semiconductor package and dual in-line memory module using the same (2003-06-03),
15. 6445077 - Semiconductor chip package (2002-09-03),

Title: Young Hee Song: Innovator in Semiconductor Technology

Introduction

Young Hee Song is a prominent inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 17 patents. His innovative work focuses on enhancing the performance and capacity of semiconductor packages and wearable smart devices.

Latest Patents

Among his latest patents, Young Hee Song has developed a package substrate comprising side pads on the edge, a chip stack, and a semiconductor package. This invention includes an integrated substrate and a bottom chip stack that features multiple memory semiconductor dies stacked chip-on-chip. It is designed to manage a portion of the overall memory capacity. Additionally, he has created a wearable smart device that incorporates a flexible semiconductor package mounted on a band. This device consists of a main body with a basic module and a band that can attach and detach auxiliary modules, allowing for a high-capacity and high-performance smart device.

Career Highlights

Young Hee Song has worked with notable companies, including Samsung Electronics Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in semiconductor technology.

Collaborations

Throughout his career, Young Hee Song has collaborated with talented individuals such as Cheol Jun Yoo and Seong Deok Hwang. These partnerships have fostered a creative environment that has led to the development of advanced technologies.

Conclusion

Young Hee Song's contributions to semiconductor technology and wearable devices highlight his role as a leading inventor in the industry. His innovative patents and collaborations continue to shape the future of technology.

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