IDiyas

For the Inventor, By the Inventor

Gyeonggi-do, South Korea

Young Hee Song

USPTO Granted Patents = 17 

 

Average Co-Inventor Count = 2.9

ph-index = 6

Forward Citations = 185(Granted Patents)


Location History:

  • Seongnam, KR (1998 - 1999)
  • Kyungki-do, KR (2002 - 2005)
  • Yongin, KR (2005 - 2007)
  • Gyunggi-do, KR (2013)
  • Gyeonggi-do, KR (2014 - 2015)
  • Seongnam-si, KR (2015 - 2019)

Company Filing History:

goldMedal15 out of 131,214 
 
Samsung Electronics Co., Ltd.
 patents
silverMedal2 out of 832,680 
Other
 patents

Years Active: 1998-2019

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17 patents (USPTO):Explore Patents
1. 10522522 - Package substrate comprising side pads on edge, chip stack, semiconductor package, and memory module comprising same (2019-12-31),
2. 10474192 - Wearable smart device having flexible semiconductor package mounted on a band (2019-11-12),
3. 9028082 - Light source module and illumination apparatus having the same (2015-05-12),
4. 8933474 - Light emitting diode package and manufacturing method thereof (2015-01-13),
5. 8894240 - Illumination device (2014-11-25),
6. 8841693 - Light emitting device package and manufacturing method thereof (2014-09-23),
7. 8722435 - Light emitting device package and method of manufacturing the same (2014-05-13),
8. 8679872 - Light emitting device package and manufacturing method thereof (2014-03-25),
9. 8587010 - Light emitting device package and method of manufacturing the same (2013-11-19),
10. 7208343 - Semiconductor chip, chip stack package and manufacturing method (2007-04-24),
11. 6855575 - Semiconductor chip package having a semiconductor chip with center and edge bonding pads and manufacturing method thereof (2005-02-15),
12. 6852607 - Wafer level package having a side package (2005-02-08),
13. 6849802 - Semiconductor chip, chip stack package and manufacturing method (2005-02-01),
14. 6573611 - Dual-lead type square semiconductor package and dual in-line memory module using the same (2003-06-03),
15. 6445077 - Semiconductor chip package (2002-09-03),
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