The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2005
Filed:
May. 10, 2002
Applicants:
Young Hee Song, Kyungki-Do, KR;
Ming Young Son, Kyungki-do, KR;
Woong KY Ha, Kyungki-Do, KR;
Inventors:
Assignee:
Samsung Electronics., LTD, Suwon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/301 ;
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a wafer level package includes forming a semiconductor wafer including semiconductor chips, and forming a package body on the sides of each semiconductor chip. The package body is formed by forming a space between each semiconductor chip and potting a package material in the space, which can be a mold resin. The wafer is then separated into separate semiconductor chips by cutting through the package body.