Woong Ky Ha

Title: Woong Ky Ha: Innovator in Semiconductor Packaging

Introduction

Woong Ky Ha is a prominent inventor based in Kyungki-do, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on innovative methods that enhance the efficiency and reliability of semiconductor devices.

Latest Patents

One of Woong Ky Ha's latest patents is titled "Wafer level package having a side package." This invention involves a method of manufacturing a wafer level package that includes forming a semiconductor wafer with semiconductor chips. The process entails creating a package body on the sides of each semiconductor chip by forming a space between them and potting a package material, such as mold resin, in that space. The wafer is subsequently separated into individual semiconductor chips by cutting through the package body.

Another notable patent is the "BGA package and method of manufacturing the same." This BGA package consists of a semiconductor chip and a printed circuit board (PCB) that features a board body, multiple circuit patterns, signal via holes, a solder resist, and thermal emissive vias. The thermal emissive vias, located beneath the chip attach area, are filled with low melting point metal to prevent moisture absorption while effectively transferring heat. The semiconductor chip is attached to the PCB and connected to the circuit patterns with bonding wires, which are encapsulated for protection against environmental stress. This design offers advantages in moisture prevention and heat transfer efficiency.

Career Highlights

Woong Ky Ha is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to advancements in packaging solutions.

Collaborations

Throughout his career, Woong Ky Ha has collaborated with notable colleagues, including Young Hee Song and Ming Young Son. These collaborations have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Woong Ky Ha is a distinguished inventor whose work in semiconductor packaging has led to significant advancements in the field. His innovative patents reflect his commitment to enhancing the performance and reliability of semiconductor devices.