The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2002
Filed:
Jul. 15, 1998
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
A BGA package includes a semiconductor chip, and a PCB having a board body, a plurality of circuit patterns, a plurality of signal via holes, a solder resist, and a plurality of thermal emissive vias. The thermal emissive vias are holes located beneath a chip attach area, and these holes are filled with metal having a low melting point. The metal prevents moisture from being absorbed, while effectively transferring heat. The semiconductor chip is attached to the chip attach area of the PCB and is connected to circuit patterns of the PCB with bonding wires. The bonding wires and the semiconductor chip are encapsulated to protect them from external environmental stress. Solder bumps are formed on circuit patterns of the PCB. The BGA package has advantages in that it prevents moisture from penetrating to the chip through the thermal emissive vias, and effectively transfers the heat generated by the chip to the outside.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile