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For the Inventor, By the Inventor

Suwa, Japan

Yoshiaki Mori

USPTO Granted Patents = 19

Average Co-Inventor Count = 2.6

ph-index = 8

Forward Citations = 287(Granted Patents)


Location History:

  • Suwa-gun, JP (2006 - 2010)
  • Suwa, JP (1998 - 2013)
  • Nagano-ken, JP (2000 - 2014)

Company Filing History:

goldMedal19 out of 33,404 
 
Seiko Epson Corporation
 patents

Years Active: 1998-2014

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19 patents (USPTO):Explore Patents
1. 8679283 - Bonding method and bonded body (2014-03-25),
2. 8617340 - Bonding method and bonded body (2013-12-31),
3. 8211259 - Separating method of bonded body (2012-07-03),
4. 7695570 - Processing-subject cleaning method and apparatus, and device manufacturing method and device (2010-04-13),
5. 7412983 - Pattern forming method and apparatus, and device fabrication method and device (2008-08-19),
6. 7282098 - Processing-subject cleaning method and apparatus, and device manufacturing method and device (2007-10-16),
7. 7148148 - Mask forming and removing method, and semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method (2006-12-12),
8. 7098121 - Method of forming a film of predetermined pattern on a surface as well as device manufactured by employing the same, and method of manufacturing device (2006-08-29),
9. 6977222 - Pattern forming method and apparatus, and device fabrication method and device (2005-12-20),
10. 6620282 - Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent (2003-09-16),
11. 6604672 - Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent (2003-08-12),
12. 6221197 - Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent (2001-04-24),
13. 6183883 - Brazing or soldering material and manufacturing method therefor (2001-02-06),
14. 6180253 - Brazing or soldering material and production method thereof (2001-01-30),
15. 6158648 - Method and apparatus for bonding using brazing material (2000-12-11),

Title: Innovations and Contributions of Yoshiaki Mori in Bonding Technology

Introduction: Yoshiaki Mori, an accomplished inventor from Suwa, Japan, has made significant strides in the field of bonding technology. With a notable portfolio of 19 patents, his work primarily focuses on advanced bonding methods that enhance the integration of materials.

Latest Patents: Among Yoshiaki's latest inventions are two patents related to bonding methods and bonded bodies. The first patent describes a method of bonding two base members together using a bonding film made from a liquid material containing silicone compounds. This innovative method includes applying the liquid to one or both base members, drying it to create a bonding film, and then applying energy to strengthen the bond. The second patent offers a similar bonding process but incorporates a fine-patterned bonding film, achieved using a liquid droplet ejecting method. This method allows for cost-effective bonding of materials with precise patterns, expanding the potential applications of his inventions.

Career Highlights: Yoshiaki Mori is currently employed by Seiko Epson Corporation, where he has been able to pioneer his research and develop innovative solutions for various industrial applications. His dedication to advancing bonding technologies has established him as a key figure in his field.

Collaborations: Throughout his career, Yoshiaki has collaborated with esteemed colleagues such as Takuya Miyakawa and Mitsuru Sato. Their combined expertise has contributed to the successful development and refinement of the bonding methods that Yoshiaki has patented.

Conclusion: With his ongoing research and development efforts, Yoshiaki Mori continues to push the boundaries of bonding technology. His contributions not only enhance the performance and reliability of bonded materials but also pave the way for future innovations in the industry.

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