The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2012
Filed:
Nov. 26, 2008
Mitsuru Sato, Suwa, JP;
Takatoshi Yamamoto, Suwa, JP;
Shintaro Asuke, Suwa, JP;
Yoshiaki Mori, Suwa, JP;
Kazuhiro Gomi, Chino, JP;
Mitsuru Sato, Suwa, JP;
Takatoshi Yamamoto, Suwa, JP;
Shintaro Asuke, Suwa, JP;
Yoshiaki Mori, Suwa, JP;
Kazuhiro Gomi, Chino, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A separating method of a bonded body, the bonded body including two base members and a bonding film through which the base members are boded together, enabling to easily and efficiently separating the bonded body into the two original base members is provided. Further, the bonding film contains a silicone material composed of silicone compounds. The separating method includes: preparing the bonded body with the bonding film; and applying energy for separation to the bonding film so that cleavage is generated within the bonding film due to breakage of a part of molecular bonds of the silicone compounds, to thereby separate the bonded body into the first and second base members.