Company Filing History:

15 out of 33,404

Seiko Epson Corporation

patents

1 out of 4,048

Alps Electric Co., Ltd.

patents

1 out of 832,680

Other

patents

where one patent can have more than one assignee

Years Active: 2002-2014

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15 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8679283 - Bonding method and bonded body (2014-03-25),

2. 8617340 - Bonding method and bonded body (2013-12-31),

3. 8486218 - Method of manufacturing a part of a MEMS system (2013-07-16),

4. 8243249 - Method of manufacturing liquid crystal device (2012-08-14),

5. 8211259 - Separating method of bonded body (2012-07-03),

6. 8101044 - Method of manufacturing bonded body and bonded body (2012-01-24),

7. 7641943 - Coating method, liquid supplying head and liquid supplying apparatus (2010-01-05),

8. 7516549 - Nozzle plate producing method (2009-04-14),

9. 7353623 - Solvent removal apparatus and method (2008-04-08),

10. 7305868 - Method and system for evaluating lyophobicity of inner wall of fine tube including lyophobic film (2007-12-11),

11. 7267426 - Liquid-repellent film-coated member, constitutive member of liquid-jet device, nozzle plate of liquid-jet head, liquid-jet head, and liquid-jet device (2007-09-11),

12. 7148148 - Mask forming and removing method, and semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method (2006-12-12),

13. 7098121 - Method of forming a film of predetermined pattern on a surface as well as device manufactured by employing the same, and method of manufacturing device (2006-08-29),

14. 6899787 - Plasma processing apparatus and plasma processing system with reduced feeding loss, and method for stabilizing the apparatus and system (2005-05-31),

15. 6342275 - Method and apparatus for atmospheric pressure plasma surface treatment, method of manufacturing semiconductor device, and method of manufacturing ink jet printing head (2002-01-29),

Title: Shintaro Asuke: Innovator in Bonding Technologies

Introduction

Shintaro Asuke is a prominent inventor based in Suwa, Japan. He has made significant contributions to the field of bonding technologies, holding a total of 15 patents. His innovative approaches have paved the way for advancements in how materials are bonded together, particularly through the use of silicone materials.

Latest Patents

Among his latest patents is a bonding method that allows for the effective bonding of two base members through a bonding film. This method involves applying a liquid material containing silicone compounds onto the surface of at least one of the base members. The liquid coating is then dried to form a bonding film, which is activated by applying energy to develop bonding properties. Another notable patent focuses on a bonding method that utilizes a liquid droplet ejecting method to create a bonding film with a fine pattern at low cost. This innovative approach enhances the efficiency and effectiveness of bonding processes.

Career Highlights

Shintaro Asuke has worked with notable companies such as Seiko Epson Corporation and Alps Electric Co., Ltd. His experience in these organizations has contributed to his expertise in developing advanced bonding technologies.

Collaborations

Throughout his career, Asuke has collaborated with talented individuals, including Mitsuru Sato and Yoshiaki Mori. These collaborations have further enriched his work and led to the development of innovative bonding solutions.

Conclusion

Shintaro Asuke's contributions to bonding technologies demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of material science and engineering, making him a key figure in the field.

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