Seiko Epson Corporation

Yoshiaki Mori

Takuya Miyakawa

Mitsuru Sato

Shintaro Asuke

Yasuhiko Asano

Osamu Kurashina

Kazuhiro Gomi

Takatoshi Yamamoto

Yasutsugu Aoki

Yohei Kurashima

Makoto Anan

Katsuhiro Takahashi

Satoshi Miyamori

Takeshi Miyashita

Kenichi Takagi

Satoru Katagami

Yasushi Karasawa

Yasutugu Aoki

Isao Kubota

Yoshio Oda

A bonding method of bonding two base members together through a bonding film is provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through the bonding film. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members to form a liquid coating on the surface; drying the liquid coating so that it is transformed into the bonding film on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.

Bonding method and bonded body

A bonding method of bonding two base members together through a bonding film having a fine pattern at low cost, and a bonded body with the bonding film which is formed using the bonding method are provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through a bonding film having a predetermined pattern. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members using a liquid droplet ejecting method, to form a liquid coating having a pattern corresponding to the predetermined pattern on the surface; drying the liquid coating so that it is transformed into the bonding film having the predetermined pattern on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.

A separating method of a bonded body, the bonded body including two base members and a bonding film through which the base members are boded together, enabling to easily and efficiently separating the bonded body into the two original base members is provided. Further, the bonding film contains a silicone material composed of silicone compounds. The separating method includes: preparing the bonded body with the bonding film; and applying energy for separation to the bonding film so that cleavage is generated within the bonding film due to breakage of a part of molecular bonds of the silicone compounds, to thereby separate the bonded body into the first and second base members.

Separating method of bonded body

The invention reduces the amounts of cleaning liquids and rinse liquid used, as well as the energy consumption. A cleaning head has a plurality of cleaning units and a drying unit. An organic substance cleaning portion of each cleaning unit blows a first cleaning agent selectively over a portion to be cleaned of a substrate, and sucks reaction products etc. through a first suction mouth. An inorganic substance cleaning portion blows a second cleaning agent over the portion to be cleaned of the substrate from which organic substance have been removed, and sucks reaction products etc. through a second suction mouth. A rinse portion blows pure water the portion of the substrate from which inorganic substance have been removed, and sucks its vapor through a third suction mouth. The drying unit dries the substrate by blowing out a heated gas from a hot wind blowing-out mouth. A light guide illuminates the portion to be cleaned of the substrate with ultraviolet light, and thereby decomposes residual organic substances.

Processing-subject cleaning method and apparatus, and device manufacturing method and device

The invention saves resources and energy. A cleaning/fluid-feeding head integrates a cleaning head portion and a fluid-feeding head portion. The cleaning head portion includes an organic substance cleaning unit, an inorganic substance cleaning unit, a rinsing unit and a drying unit. The organic substance cleaning unit, inorganic substance cleaning unit and rinsing unit selectively clean pattern forming regions on a substrate by feeding thereto a first cleaning fluid, second cleaning fluid and pure water, respectively. The drying unit dries the rinsed pattern forming regions by blowing hot air thereonto. The fluid-feeding head portion selectively feeds a liquid pattern forming material to the cleaned pattern forming regions.

Pattern forming method and apparatus, and device fabrication method and device

A method for reducing energy consumption, and amounts of cleaning liquids and rinse liquids used. A cleaning head has a plurality of cleaning units and a drying unit. The organic, and inorganic, substance cleaning portions of each cleaning head, blows a first, and a second, cleaning agent selectively over a portion to be cleaned of a substrate, and sucks reaction products etc. through a first, and second, suction mouth, respectively. A rinse portion blows pure water over the portion of the substrate from which inorganic substances have been removed, and sucks its vapor through a third suction mouth. The drying unit dries the substrate by blowing out a heated gas from a hot wind blowing-out mouth. A light guide illuminates the portion to be cleaned, of the substrate, with ultraviolet light, and thereby decomposes residual organic substances.

A mask forming method that can reduce manufacturing cost is disclosed. The method forms a mask on the surface of a member to be processed in order to form a desired pattern using liquid material for patterning. The method also includes applying resist to the entire surface of the member to be processed, drying the applied resist, patterning by removing the resist in a pattern-formation area using photolithography, and heating the resist.

Mask forming and removing method, and semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method

An object is to provide a mask formation method, which can curtail a manufacturing cost. A method of forming a film of predetermined pattern on the front surface of a member to-be-processed is so constructed as to carry out the step (S) of improving the adherence of a pattern material solution to the member to-be-processed, the step (S) of filling up a pattern forming recess provided in a mask on the surface of the member to-be-processed with a pattern material solution, the step (S) of improving the film quality of the pattern film to-be-formed by processing the pattern material solution, the step (S) of removing the pattern material solution having adhered on the mask, the step (S) of drying the pattern material solution, and the step (S) of subjecting the pattern film to annealing processing.

Method of forming a film of predetermined pattern on a surface as well as device manufactured by employing the same, and method of manufacturing device

A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members and is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit and water vapor from a vapor generator in a fluorination process section The bond members and are then placed in contact at the fluorinated surface on table in bonding process section Argon is then introduced to bonding chamber Pressure is then applied to the first bond member and second bond member by a cylinder and heated to below the melting point by a heater to bond the first and second bond members together.

Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent

A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members and is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit and water vapor from a vapor generator in a fluorination process section . The bond members and are then placed in contact at the fluorinated surface on table in bonding process section . Argon is then introduced to bonding chamber . Pressure is then applied to the first bond member and second bond member by a cylinder , and heated to below the melting point by a heater , to bond the first and second bond members together.

A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members,and,is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit,and water vapor from a vapor generator,in a fluorination process section,. The bond members,and,are then placed in contact at the fluorinated surface on table,in bonding process section,. Argon is then introduced to bonding chamber,. Pressure is then applied to the first bond member,and second bond member,by a cylinder,, and heated to below the melting point by a heater,, to bond the first and second bond members together.

Brazing or soldering materials which effectively improve the wettability of the brazing alloy or solder without using flux and a method of manufacturing such materials are provided. A metallic base is placed on turntable inside a vacuum chamber. A copper target is affixed to a sputtering electrode above the metallic base. Air is removed from the vacuum chamber through a vacuum outlet to increase the vacuum therein to a specific pressure, and carbon tetrafluoride and argon are introduced from a gas inlet to control the sputter pressure. Thereafter, turntable is rotated while a high frequency voltage is applied between the target and the metallic base to form a halide layer, such as a layer of copper fluoride, on a surface of metallic base.

Brazing or soldering material and manufacturing method therefor

The present invention provides a joining, brazing or soldering material wherein solderability is effectively improved without using a flux, and a production method thereof. In production of a joining material, a halogen compound is mixed, a film is formed on the surface of a solder molding or the surface of a solder molding is halogenated. In production of a joining material, a halogen compound is added to a solder melt, a film of a halogen compound is formed on the surface of a processed joining material, or the surface layer of the processed joining material is converted to a halogen compound layer by halogenation. Film formation or surface treatment may be carried out either a dry or wet method.

Brazing or soldering material and production method thereof

High frequency electrical discharge or nonpolar discharge using microwaves is generated in a gas that is introduced into a gas duct formed by a dielectric material, such as glass or ceramic. Surface treatment is applied to the components, which are under atmospheric pressure, by exposing them to the gas flow containing the active species generated by the above mentioned electrical discharge. Components are soldered before, during, or after the application of this surface treatment. The surface of the components is exposed to the active species by either directly exposing the components to the electrical discharge, or by blasting the reactive gas flow containing the active species at them. By selecting an appropriate gas for generating the active species, it is possible to improve the wettability of the surface of the component to be soldered, or to remove the organic substances or the oxide film.

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Suwa, Japan

Yoshiaki Mori