The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2003
Filed:
Mar. 05, 2001
Applicant:
Inventors:
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 5/00 ;
U.S. Cl.
CPC ...
C09J 5/00 ;
Abstract
A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members and is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit and water vapor from a vapor generator in a fluorination process section . The bond members and are then placed in contact at the fluorinated surface on table in bonding process section . Argon is then introduced to bonding chamber . Pressure is then applied to the first bond member and second bond member by a cylinder , and heated to below the melting point by a heater , to bond the first and second bond members together.