Yonghwan Kwon

This inventor holds 32 USPTO granted patents and 9 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging. Top assignees: Samsung Electronics Co., Ltd., Samsung Electronics Ltd., Sansumg Electronics Co., Ltd.. Active years: 2012-2026.

USPTO Granted Patents = 32 (Patent Applications = 9)

% Patents Active = 78.1

EPO Patents = 2 (Patent Applications = 6)

Average Co-Inventor Count = 1.8

ph-index = 5

Forward Citations = 71(Granted Patents)

Location History:

Suwon, KR (2012)
Suwon-si, KR (2013 - 2023)
Yongin-si, KR (2023 - 2024)

Company Filing History:

25 out of 132,108

Samsung Electronics Co., Ltd.

patents

5 out of 6,034

Samsung Electronics Ltd.

patents

1 out of 2

Sansumg Electronics Co., Ltd.

patents

where one patent can have more than one assignee

Years Active: 2012-2026

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Areas of Expertise:

Semiconductor Package

Fan-Out Package

Transitional GUI

Electronic Device Control

Microelectronic Devices

Solder Bumps

Redistribution Structure

Guide Rings

Conductive Vias

Insulating Layers

32 patents (USPTO):Sort by Forward CitationsExplore Patents

1. D1139453 - Display screen or portion thereof with transitional graphical user interface (2026-08-04),

2. D1139452 - Display screen or portion thereof with transitional graphical user interface (2026-08-04),

3. 12701997 - Semiconductor package and method of manufacturing the semiconductor package (2026-08-04),

4. D1135927 - Display screen or portion thereof with transitional graphical user interface (2026-07-21),

5. 12681678 - Electronic device and method for controlling electronic device (2026-07-14),

6. 12550749 - Semiconductor package (2026-02-10),

7. 12456704 - Semiconductor package and method for manufacturing semiconductor package (2025-10-28),

8. 12315824 - Semiconductor package (2025-05-27),

9. 12287960 - Electronic apparatus and controlling method thereof (2025-04-29),

10. 12261103 - Semiconductor package (2025-03-25),

11. 12191221 - Semiconductor package (2025-01-07),

12. 12027432 - Semiconductor packages (2024-07-02),

13. 11996378 - Semiconductor package and method for manufacturing semiconductor package (2024-05-28),

14. 11961792 - Fan-out semiconductor package including under-bump metallurgy (2024-04-16),

15. 11854912 - Semiconductor package including a chip pad having a connection portion and test portion in a first surface of the chip pad (2023-12-26),

Title: The Innovative Journey of Inventor Yonghwan Kwon

Introduction: Yonghwan Kwon, a talented male inventor hailing from Suwon-si, South Korea, has made significant contributions to the field of innovation with his creative ideas and groundbreaking inventions.

Latest Patents: Yonghwan Kwon holds several patents in various technological domains, showcasing his versatility and expertise in inventing cutting-edge solutions to real-world problems.

Career Highlights: Throughout his illustrious career, Yonghwan Kwon has demonstrated a keen eye for identifying gaps in the market and developing unique inventions to address them. His innovative spirit and dedication to pushing the boundaries of technology have earned him recognition as a pioneer in the industry.

Collaborations: Yonghwan Kwon has collaborated with leading research institutions, universities, and companies to further his inventions and bring them to market. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: In conclusion, Yonghwan Kwon's passion for innovation, coupled with his technical expertise, has established him as a prominent figure in the world of inventors. His relentless pursuit of excellence and commitment to creating impactful solutions continue to inspire the next generation of innovators.