The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
May. 03, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Yonghwan Kwon, Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A semiconductor package includes a first redistribution wiring layer including a first redistribution wiring layer having a plurality of first redistribution wires, and a plurality of first bonding pads electrically connected to the first redistribution wires and exposed from a lower surface, a first semiconductor substrate on an upper surface of the plurality of first redistribution wiring layer, the first semiconductor substrate having at least one first semiconductor chip and through vias that are electrically connected to the first redistribution wires, and the first semiconductor substrate having a first heat dissipation structure that surrounds an outer surface of the first semiconductor chip, a second redistribution wiring layer on the first semiconductor substrate, and the second redistribution having a plurality of second redistribution wires that are electrically connected to the through vias, and a second semiconductor substrate having at least one second semiconductor chip that is electrically connected to the plurality of second redistribution wires, and a second heat dissipation structure surrounding an outer surface of the second semiconductor chip.