The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2025
Filed:
Jan. 05, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Yonghwan Kwon, Yongin-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes a semiconductor chip on a first redistribution substrate, a molding layer that covers the semiconductor chip, and a second redistribution substrate on the molding layer and that includes a dielectric layer, a redistribution pattern, and a conductive pad. The dielectric layer includes a lower opening that exposes the conductive pad, and an upper opening connected to the lower opening and that is wider than the lower opening. The semiconductor package also comprises a redistribution pad on the conductive pad and that covers a sidewall of the lower opening and a bottom surface of the upper opening. A top surface of the dielectric layer is located at a higher level than a top surface of the redistribution pad. The top surface of the redistribution pad is located on the bottom surface of the upper opening.