The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Mar. 09, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); H01L 23/3128 (2013.01); H01L 24/05 (2013.01); H01L 24/24 (2013.01); H01L 2224/022 (2013.01); H01L 2224/24226 (2013.01);
Abstract
A semiconductor package is provided. The semiconductor package includes a chip pad of a semiconductor chip, the chip pad including a connection portion and a test portion in a first surface of the chip pad; a barrier layer covering the chip pad, the barrier layer defining a first opening and a second opening that is separate from the first opening, the first opening exposing the connection portion of the chip pad, and the second opening exposing the test portion of the chip pad; and a redistribution structure.