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For the Inventor, By the Inventor

Plano, TX, United States of America

Yong L Xu

USPTO Granted Patents = 9

Average Co-Inventor Count = 4.8

ph-index = 5

Forward Citations = 114(Granted Patents)


Company Filing History:

goldMedal9 out of 1,284 
 
Maxim Integrated Products, Inc.
 patents

Years Active: 2011-2017

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9 patents (USPTO):
1. 9583425 - Solder fatigue arrest for wafer level package (2017-02-28),
2. 9425160 - Wafer-level package device with solder bump reinforcement (2016-08-23),
3. 9397027 - Sacrificial pad on semiconductor package device and method (2016-07-19),
4. 9093333 - Integrated circuit device having extended under ball metallization (2015-07-28),
5. 9087732 - Wafer-level package device having solder bump assemblies that include an inner pillar structure (2015-07-21),
6. 9040408 - Techniques for wafer-level processing of QFN packages (2015-05-26),
7. 8643150 - Wafer-level package device having solder bump assemblies that include an inner pillar structure (2014-02-04),
8. 8575493 - Integrated circuit device having extended under ball metallization (2013-11-05),
9. 8084871 - Redistribution layer enhancement to improve reliability of wafer level packaging (2011-12-27),

Title: The Innovations of Yong L Xu: Pioneering in Wafer-Level Packaging

Introduction

Yong L Xu, an accomplished inventor based in Plano, TX, has made significant contributions to the field of semiconductor technology, exemplified by his impressive portfolio of nine patents. His work primarily focuses on advancements in wafer-level packaging, addressing critical challenges in the reliability and performance of electronic devices.

Latest Patents

Among his latest patents, one notable invention is the "Solder Fatigue Arrest for Wafer Level Package." This patent outlines a wafer-level package design that incorporates a lead for electrical connection, a core with specific dimensions and configurations to enhance the reliability of solder connections. Additionally, the core may exhibit various shapes, including a stud-shape, providing innovative solutions to common packaging issues.

Another significant patent is for a "Wafer-level Package Device with Solder Bump Reinforcement." This invention details a semiconductor device featuring a reinforcement layer that fortifies solder bumps, which are critical for attaching integrated circuits to semiconductor substrates. This innovative design helps ensure greater durability and performance under varying conditions.

Career Highlights

Yong L Xu currently works at Maxim Integrated Products, Inc., where he plays a crucial role in advancing semiconductor technologies. His technical expertise and innovative mindset have driven the development of cutting-edge solutions that enhance the functionality and longevity of electronic components.

Collaborations

Throughout his career, Xu has collaborated with several notable engineers, including Arkadii V Samoilov and Viren V Khandekar. These partnerships have fostered an environment of creativity and shared knowledge, resulting in numerous advancements in the semiconductor field.

Conclusion

Yong L Xu's contributions to wafer-level packaging demonstrate his commitment to innovation and excellence in semiconductor technology. With a strong portfolio of patents and meaningful collaborations, he continues to shape the future of electronic device reliability and performance. His work not only advances the industry but also inspires future inventors in the field.

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