Cupertino, CA, United States of America

Yong Du


Average Co-Inventor Count = 3.6

ph-index = 2

Forward Citations = 37(Granted Patents)


Company Filing History:


Years Active: 2007-2014

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6 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Inventor Yong Du

Introduction

Yong Du is a notable inventor based in Cupertino, CA, known for his significant contributions to the field of integrated circuit technology. With an impressive portfolio of 6 patents, Du has demonstrated a commitment to advancing the capabilities of electronic components through innovative design and engineering.

Latest Patents

Among Yong Du's latest inventions is a patent for a "Vertical electrical interconnect formed on support prior to die mount." This invention involves a die assembly where a die is mounted to a support that features interconnect pedestals at bond pads, enabling a compact and efficient interconnection system. The method elaborated within this patent entails precisely aligning the die's interconnect terminals with the corresponding pedestals, enhancing the reliability and performance of the electrical connections.

Another notable patent of Yong Du's is for "Wafer level surface passivation of stackable integrated circuit chips." This invention introduces an electrically insulative conformal coating that is applied during wafer processing, improving the durability of integrated circuit chips. The coated die not only protects the active side but also the sidewalls, thereby facilitating better assembly of stackable die units that are interconnected to form sophisticated electronic systems.

Career Highlights

Yong Du has held significant positions in reputable companies within the technology sector, including Spansion LLC and Vertical Circuits, Inc. His work in these organizations has allowed him to contribute to various groundbreaking projects, expanding his expertise in the design and fabrication of integrated circuits.

Collaborations

Throughout his career, Yong Du has collaborated with various talented professionals, including Simon J. S. McElrea and Terrence Caskey. These partnerships have undoubtedly enriched his innovations and propelled advancements in the projects they worked on together, combining their expertise to achieve excellence in circuit design.

Conclusion

Yong Du's contributions to the realms of integrated circuit technology, underscored by his innovative patents, highlight the importance of inventors in shaping modern electronics. His dedication to improving the interconnectivity and efficiency of electronic components continues to inspire advancements in the industry. As technology evolves, the impact of inventors like Yong Du will undoubtedly continue to resonate.

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