The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2014
Filed:
Mar. 12, 2008
Terrence Caskey, Santa Cruz, CA (US);
Lawrence Douglas Andrews, Jr., Los Gatos, CA (US);
Scott Mcgrath, Scotts Valley, CA (US);
Simon J. S. Mcelrea, Scotts Valley, CA (US);
Yong Du, Cupertino, CA (US);
Mark Scott, Monte Sereno, CA (US);
Terrence Caskey, Santa Cruz, CA (US);
Lawrence Douglas Andrews, Jr., Los Gatos, CA (US);
Scott McGrath, Scotts Valley, CA (US);
Simon J. S. McElrea, Scotts Valley, CA (US);
Yong Du, Cupertino, CA (US);
Mark Scott, Monte Sereno, CA (US);
Invensas Corporation, San Jose, CA (US);
Abstract
A die assembly includes a die mounted to a support, in which the support has interconnect pedestals formed at bond pads, and the die has interconnect terminals projecting beyond a die edge into corresponding pedestals. Also, a support has interconnect pedestals. Also, a method for electrically interconnecting a die to a support includes providing a support having interconnect pedestals formed at bond pads on the die mount surface of the support, providing a die having interconnect terminals projecting beyond a die edge, positioning the die in relation to the support such that the terminals are aligned with the corresponding pedestals, and moving the die and the support toward one another so that the terminals contact the respective pedestals.