The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2010
Filed:
Dec. 19, 2006
Applicants:
Yong Du, Cupertino, CA (US);
John Yan, Union City, CA (US);
Assignee:
Spansion LLC, Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method and apparatus are provided for multi-chip packaging. A multi-chip package () includes a substrate () and a plurality of semiconductor dice (). A first semiconductor die () is physically coupled to an upper face of the substrate (), the first semiconductor die () being a smallest one of the plurality of semiconductor dice ().
Du, Yong. (2010). Method and apparatus for multi-chip packaging (U.S. Patent No. 7691668). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7691668
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile