Rehovot, Israel

Yoav Miller

USPTO Granted Patents = 7 

 

Average Co-Inventor Count = 3.9

ph-index = 2

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2015-2020

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7 patents (USPTO):Explore Patents

Title: Yoav Miller: Innovator in 3D Printing Technologies

Introduction

Yoav Miller is a prominent inventor based in Rehovot, Israel, known for his significant contributions to the field of 3D printing. With a total of seven patents to his name, Miller has developed innovative methods and systems that enhance the efficiency and accuracy of 3D printing processes.

Latest Patents

Miller's latest patents include a method for analyzing gaps and shell weak spots in 3D objects, which generates support structures to fill these gaps. This apparatus allows for the creation of support structures that can be located within the inner space of hollow 3D objects. In cases where the inner structure cannot support the designated segment, the support structure can be implemented outward. Another notable patent is a system designed to shield printer heads and nozzles from curing radiation. This system prevents undesired curing of material residues that may adhere to the printer's external surfaces or inside the nozzle openings, thereby maintaining the accuracy of the printing process.

Career Highlights

Throughout his career, Miller has worked with several notable companies, including Massivit 3D Printing Technologies Ltd. and Freescale Semiconductor, Inc. His experience in these organizations has contributed to his expertise in 3D printing technologies and innovation.

Collaborations

Miller has collaborated with talented individuals in the industry, including Igor Yakubov and Moshe Uzan. These partnerships have further enriched his work and contributed to the development of advanced 3D printing solutions.

Conclusion

Yoav Miller's innovative work in 3D printing technologies has made a significant impact on the industry. His patents and career achievements reflect his dedication to advancing the field and improving the capabilities of 3D printing.

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