Massivit 3d Printing Technologies Ltd.

Freescale Semiconductor,inc.

Nxp Usa, Inc.

Yoav Miller

Igor Yakubov

Moshe Uzan

Asher Berkovitz

Nataly Lisitsin

Yoav Aboudi

Victoria Gordon

Michael Priel

Sergey Sofer

Dan Kuzmin

Amir Grinshpon

Aharon Weiss

Gilad Arnon

Itzhak Taff

Slavaf Fleshel

An apparatus and method for generating support structures to 3D objects. The support structure could be located in an inner space or cavity of a hollow 3D object. In some examples, where the inner structure cannot support the designated segment of the 3D object, the support structure could be implemented outwards.

Method for analyzing gaps and shell weak spots for 3D objects and generating support structures that fill the gaps and shell weak spots

Various shielding systems to shield printer heads, extrusion nozzles and extrusion nozzle openings from direct or reflected impingement thereupon of curing radiation so that to prevent undesired inadvertent curing of material residues adhered to the external surface of the printer extrusion nozzle and/or inside the nozzle opening forming cured residues that may compromise the accuracy of the printing process.

System for shielding printer heads and nozzles from curing radiation

The current three-dimensional object manufacturing technique relies on the deposition of a pseudoplastic material in gel aggregate state. The gel flows through a deposition nozzle because the applied agitation and pressure shears the bonds and induces a breakdown in the material elasticity. The elasticity recovers immediately after leaving the nozzle, and the gel solidifies to maintain its shape and strength.

Method and appratus for manufacture of 3D objects

A method and apparatus of validating a test pattern for at-speed testing of at least one integrated circuit, IC, design. The method comprises calculating at least one weighted rise activity, WRA, value for at least one region of the IC design based at least partly on rising gate transitions within the at least one region of the IC design when the test pattern is applied thereto, calculating at least one weighted fall activity, WFA, value for the at least one region of the IC design based at least partly on fall gate transitions within the at least one region of the IC design when the test pattern is applied thereto, and validating the test pattern based at least partly on the WRA value and the WFA value.

Method and apparatus for validating a test pattern

A method and apparatus for selecting data path elements for cloning within an integrated circuit (IC) design is described. The method comprises performing timing analysis of at least one data path within the IC design to determine at least one timing slack value for the at least one data path, calculating at least one annotated delay value for cloning a candidate element within the at least one data path, calculating at least one modified slack value for the at least one data path in accordance with the at least one calculated annotated delay value, and validating the cloning of the candidate element based at least partly on the at least one modified slack value.

Method and apparatus for selecting data path elements for cloning

An apparatus for additive manufacturing of large 3D hollow objects with thin walls, includes a 3D hollow object material deposition module configured to deposit a portion of material forming at least a layer of a 3D hollow object wall; a 3D hollow object material solidifying module configured to solidify at least the portion of material forming at least a layer of the 3D hollow object wall; and a support material dispensing module configured to dispense a support material across a cross section of the 3D hollow object wall. The support material is dispensed separately prior to or concurrently with the deposition of the portion of material forming at least a layer of a 3D hollow object wall.

Large shells manufacturing apparatus

Method of forming a three-dimensional object

Growing community of inventors

Rehovot, Israel

Yoav Miller