Company Filing History:
Years Active: 2018-2024
Title: Innovations of Ying Ern Ho
Introduction
Ying Ern Ho is a notable inventor based in Bayan Lepas, Malaysia. He has made significant contributions to the field of electrical engineering, particularly in the development of advanced transmission line architectures and methods for mitigating radio frequency interference.
Latest Patents
Ying Ern Ho holds a total of 6 patents. His latest patents include a "Self-equalized and self-crosstalk-compensated 3D transmission line architecture with an array of periodic bumps for high-speed single-ended signal transmission." This invention encompasses package substrates and methods for forming these substrates. The package substrate features a dielectric layer over a conductive layer, with conductive lines and bumps strategically placed to enhance signal transmission. Another recent patent is for "Pattern-edged metal-plane resonance-suppression," which provides methods for controlling impedance at the edges of circuit boards to mitigate radio frequency interference and electromagnetic compatibility issues.
Career Highlights
Ying Ern Ho is currently employed at Intel Corporation, where he continues to innovate and develop cutting-edge technologies. His work has been instrumental in advancing the capabilities of electronic devices and improving their performance.
Collaborations
Ying Ern Ho has collaborated with notable colleagues, including Stephen H Hall and Khang Choong Yong. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of innovative solutions.
Conclusion
Ying Ern Ho's contributions to the field of electrical engineering are significant and impactful. His patents reflect a commitment to innovation and excellence in technology. His work at Intel Corporation and collaborations with esteemed colleagues further enhance his reputation as a leading inventor in his field.