Intel Corporation

Ying Ern Ho

Khang Choong Yong

Stephen H Hall

Wil Choon Song

Yun Rou Lim

Natasya Athirah Abdul Khalid

Hao-Han Hsu

Jaejin Lee

Kai Chong Ng

Florence Su Sin Phun

Wooi Jou Tan

Yee Hung See Tau

Asmah Truky

Embodiments include package substrates and method of forming the package substrates. A package substrate includes a dielectric over a conductive layer, and a conductive line on the dielectric. The package substrate includes a plurality of conductive bumps on a surface of the conductive line, where the conductive bumps are conductively coupled to the conductive line, and a solder resist over the conductive line and the dielectric. The surface of the conductive line may be a bottom surface, where the conductive bumps are below the conductive line and conductively coupled to the bottom surface of the conductive line, and where the conductive bumps may be embedded in the dielectric. The surface of the conductive line may be a top surface, where the conductive bumps are above the conductive line and conductively coupled to the top surface of the conductive line, and wherein the conductive bumps are embedded in the solder resist.

Self-equalized and self-crosstalk-compensated 3D transmission line architecture with array of periodic bumps for high-speed single-ended signal transmission

Apparatuses and methods are provided for mitigating radio frequency interference and electromagnetic compatibility issues caused by the resonance of metal planes of a circuit board. A method for controlling impedance at an edge of a circuit board includes creating a cut at an edge of a plane of the circuit board. The cut extends from the edge of the plane to a point at a depth into the plane. The method can further include creating a cut pattern in the edge of the plane by repeating the cut along the edge of the plane such that an impedance of the plane at the depth is different, or lower, than an impedance of the plane at the edge of the plane. Other aspects are described.

Pattern-edged metal-plane resonance-suppression

Apparatus, systems, articles of manufacture, and methods for adaptive display control in virtual reality environments are disclosed. An example virtual reality display device for adaptive display control in a virtual reality environment includes a scanner to detect a first size of a pupil of an eye of a user. The device also includes an analyzer to determine a first characteristic of a display image, reference a second pupil size based on the first characteristic of the display image, compare the first pupil size and the second pupil size, and adjust a second characteristic of the display image when the second pupil size is different than the first pupil size. The device also includes a display screen to present the second characteristic.

Virtual reality adaptive display control

A printed circuit board (PCB) includes a dielectric plane and a ground plane parallel to and spaced apart from the dielectric plane. The dielectric plane includes a pair of signal traces and a 3-dimensional (3D) grounded (GND) fence located between the pair of signal traces. The 3D GND fence is electrically connected to the ground plane, and protrudes perpendicularly from the dielectric plane. The 3D GND fence is located equidistant from each of the pair of signal traces, and the 3D GND fence is configured to block electromagnetic interference (EMI) from a first of the pair of signal traces to a second of the pair of the signal traces. The pair of signal traces is configured to form part of a noise-sensitive electronic circuit. The 3D GND fence may have a rectangular configuration.

Noise sensitive trace 3D ground-shielding crosstalk mitigation

Embodiments herein may relate to a package with one or more layers. A silicon die may be coupled with the one or more layers via an adhesive. A package stiffener may also be coupled with the adhesive adjacent to the die. A magnetic thin film may be coupled with the package stiffener. Other embodiments may be described and/or claimed.

Growing community of inventors

Bayan Lepas, Malaysia

Ying Ern Ho